Texas Instruments (TI) has announced that it is the recipient of up to $1.6 billion in funding from the U.S. Department of Commerce under the CHIPS Act. The funding will support three new 300mm semiconductor wafer fabs currently under construction in Sherman, Texas, and Lehi, Utah.
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X-FAB Silicon Foundries SE, a leader in analog/mixed-signal and specialty semiconductor manufacturing, has introduced XSICM03, the company’s next-generation XbloX platform for Silicon Carbide (SiC) power MOSFETs. This advanced platform delivers a significant reduction in cell pitch, increasing die per wafer while improving on-state resistance and maintaining robust reliability.
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Power Integrations, a provider of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has introduced a wide-creepage package option for its InnoSwitch™3-AQ flyback automotive switcher IC, designed to meet the stringent requirements of next-generation EVs.
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Diodes Incorporated, a global provider of high-quality semiconductor products, has introduced the AL8866Q, an automotive-compliant DC-switching LED driver-controller. This advanced device drives external MOSFETs and supports multiple topologies, including buck, boost, buck-boost, and single-ended primary-inductance converter (SEPIC) configurations for high-power LED lighting systems.
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GlobalFoundries has joined the LOT Network, a global non-profit patent licensing platform that protects its members from litigation by patent assertion entities (PAEs), commonly referred to as “patent trolls.” Semiconductor leader joins the world’s largest patent protection community to shield customers and the ecosystem from patent assertion entities. This move places GF among more than […]
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Bosch, a global leader in semiconductor and automotive technologies, has signed a preliminary memorandum of terms (PMT) with the U.S. Department of Commerce, securing up to $225 million in proposed direct funding under the CHIPS and Science Act. This funding will support Bosch’s
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Ayar Labs, global experts in optical interconnect solutions for large-scale AI workloads, has announced that it has successfully raised $155 million in Series D funding address the bottlenecks in data movement for AI infrastructure with its optical I/O technology.
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CEA-Leti researchers have developed the first device capable of both sensing and modulating light within a single unit. This innovation integrates a liquid crystal cell with a CMOS image sensor, enabling a compact and scalable system with intrinsic optical alignment. The breakthrough is expected to drive the adoption of digital optical phase conjugation (DOPC) techniques […]
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TOPPAN Inc., a wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has announced its participation in US-JOINT, a US-Japan consortium dedicated to advancing next-generation semiconductor packaging.
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IBM has unveiled a breakthrough in co-packaged optics (CPO) technology, leveraging polymer optical waveguides (PWG) to significantly enhance AI data center performance. This advancement represents the first successful implementation of PWG to support CPO, as detailed in IBM Research’s recently published technical paper. The innovation enables high-bandwidth optical connectivity, offering faster AI model training, improved […]
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