About Featured Expert: NHanced Semiconductors

NHanced Semiconductors (NHanced), a wholly owned subsidiary of Quantum Computing Inc. (QCi), are U.S. industry experts in advanced semiconductor packaging. The company provides comprehensive back-end-of-line foundry services for high-mix, low-to-medium-volume requirements, supporting customers from individual unit processes through wafer-level turnkey manufacturing. Their advanced packaging capabilities include chiplet integration, hybrid bonding, heterogeneous integration, silicon interposers and 2.5D and 3D device architectures. NHanced supports wafer-to-wafer, die-to-wafer, die-to-die and chiplet-to-interposer integration, with face-to-face, face-to-back and back-to-back configurations.

In addition, their wafer stacking capabilities can accommodate more than three active device wafers within a single stack. The company’s bonding technology capabilities include low-temperature bonding, ZiBond® covalent oxide bonding, DBI® copper or nickel hybrid bonding, thermocompression bonding and temporary bonding and debonding. Hybrid bonding capabilities further support fine-pitch interconnection through concurrent dielectric-to-dielectric and embedded metal-to-metal bonding. This provides an alternative to solder-based interconnects for high-density 2.5D and 3D integration.

NHanced Featured Expert Profile Logo on Semiconductor Industry MonthlyNHanced also designs and manufactures customized interposers with through-silicon vias using silicon, fused silica, borosilicate glass and organic substrates. Their capabilities include thick-layer copper damascene, stitched fields extending to full-wafer scale, frontside and backside component mounting, chiplet integration and copper, nickel and aluminum redistribution layers. The company’s broader BEoL process portfolio encompasses silicon thinning by grinding, chemical mechanical polishing, dry etching and wet etching; TSV insertion using backside or via-middle processes; plasma dicing; surface planarization; stress compensation; cleaning and deposition; infrared alignment; backside passivation; delta doping; antireflective coatings; backside interconnects and pad opening.

NHanced works with conventional and specialized materials, including III-V compound semiconductors, and supports photonics integration, microfluidics, micro-transfer printing and other device requirements that might fall outside conventional high-volume OSAT process flows. Their Foundry 2.0 model is designed to integrate dies, chiplets, interposers and specialized materials from multiple sources without competing with the front-end foundries supplying those devices.

The company’s ISO 9001:2015-certified research, development and prototyping facility is based in Morrisville, North Carolina. It supports process development, rapid prototyping, 3D integrated circuits and interposer assemblies on wafers up to 200 mm, including small specialty wafers. This combination of process flexibility and domestic manufacturing supports semiconductor programs across industrial, medical, military, aerospace, scientific and specialized sensor markets.

QCi completed its acquisition of NHanced in June 2026. NHanced continues to operate under its established name and management structure, serving existing customers while operating as QCi’s Fab 2. The acquisition adds NHanced’s advanced semiconductor packaging and manufacturing capabilities to QCi’s broader quantum optics, integrated photonics and nanophotonics technology platform.

For more information, please click here.

(Editor’s Note: All trademarks mentioned in this article, including company names, product names, and logos, are the property of their respective owners. Use of these trademarks is for informational purposes only and does not imply any endorsement.)

Molly Bakewell Chamberlin
Latest posts by Molly Bakewell Chamberlin (see all)
Tagged