ACM Research, a supplier of wafer and panel processing equipment for semiconductor and advanced packaging applications, has expanded its Ultra C Tahoe system into a multi-process wet processing platform, adding advanced wet etch and monitor wafer reclaim capabilities for logic and memory manufacturing. Built around ACM’s hybrid wet processing architecture, the platform combines batch and single-wafer processes within a common system, supporting the longer process times and reduced chemical consumption associated with batch cleaning while retaining the high particle removal efficiency, reduced wafer-to-wafer cross-contamination and precise process-time control of single-wafer cleaning.

ACM Research Ultra C Tahoe semiconductor wet processing platform | Semiconductor Industry Monthly

The ACM Research Ultra C Tahoe platform combines batch and single-wafer processing for advanced semiconductor wet cleaning, etch and monitor wafer reclaim applications.

With the expanded capabilities, the Ultra C Tahoe platform can consolidate multiple processing steps previously performed on separate tools, reducing wafer transfers and shortening process cycle times while combining etching, advanced cleaning and drying functions within the same platform. The addition of bench nitrogen bubbling technology extends the system to applications including uniform silicon nitride recess etching, polysilicon etching and etch-back, tungsten recess processing and silicon-germanium recess etching, while ACM’s SAPS, TEBO and SMT technologies, together with hot IPA drying, provide additional process capabilities intended to minimize damage to patterned structures.

The platform also adds monitor wafer reclaim processing for advanced semiconductor manufacturing, combining film and residue removal, cleaning and drying within the hybrid architecture to reduce transfers between separate process tools and improve overall process efficiency. Used to track equipment conditions and process stability, monitor wafers can be reclaimed through the Tahoe Recycle process, which provides film-removal capabilities for double-side-coated and thick-film wafers, with the application now operating in volume production at customer facilities.

For particle and contamination control, ACM states that the Ultra C Tahoe platform has achieved an average particle count of fewer than six particles at 26 nm, with surface metal contamination below 1 × 10⁹ atoms/cm². The hybrid architecture can also reduce sulfuric acid consumption by up to 75%, lowering chemical requirements and associated waste while helping reduce processing costs for high-volume semiconductor manufacturing.

About ACM Research

ACM Research develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD and wafer- and panel-level packaging tools for advanced and semi-critical semiconductor device manufacturing. The company develops process solutions designed to help semiconductor manufacturers improve productivity and product yield across multiple manufacturing steps. For more information, please click here.

Source/Photo Credit: ACM Research

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Molly Bakewell Chamberlin
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