Amkor Technology, Inc. has broken ground on its new state-of-the-art outsourced advanced packaging and test campus in Arizona.  The company announced that its total investment for the project has expanded to $7 billion across two phases. This includes additional cleanroom space and a second greenfield packaging and test facility, marking a more than $5 billion increase from initial plans. Upon completion, the campus will feature over 750,000 square feet of cleanroom space, creating up to 3,000 high-quality jobs.

Construction of the first manufacturing facility is expected to finish in mid-2027, with production beginning in early 2028. The new greenfield facilities will support customers, including Apple and NVIDIA, and will serve as a cornerstone of America’s advanced packaging ecosystem. The investment is supported by the CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and state and local governments.

Rendering of Amkor Technology Arizona courtesy and copyright Amkor Technology

Amkor Technology has broken ground on its new $7 billion advanced semiconductor packaging and test campus in Peoria, Arizona. (Rendering courtesy and copyright Amkor Technology, Inc.)

“This groundbreaking represents a bold step in Amkor’s long-term strategy for growth and innovation,” said Giel Rutten, Amkor’s president and chief executive officer. “We’re building a facility to meet our customers’ most advanced needs that will help shape the future of semiconductor manufacturing in the United States. Arizona offers the right mix of talent, infrastructure, and industry presence, and we’re proud to deepen our roots here.”

Strategically located in Arizona’s growing high-tech corridor, the new campus will feature smart factory technologies and scalable production lines to serve markets including AI, high-performance computing, mobile communications, and automotive applications. The facilities will focus on advanced packaging and testing technologies, complementing TSMC’s front-end wafer fabrication capabilities for end-to-end semiconductor manufacturing.

“At Apple, we’re excited to help lead the creation of an end-to-end silicon supply chain in America,” said Sabih Khan, Apple’s Chief Operating Officer. “Factories across the United States are producing 19 billion chips for Apple this year alone, and Amkor’s new facility will package and test the Apple silicon produced at TSMC Arizona just down the road. We’re proud to invest in Amkor through Apple’s American Manufacturing Program, which is a key part of our $600 billion commitment to create jobs and accelerate innovation right here in the U.S.”

“AI has ignited a new industrial revolution — and with it, the chance to reindustrialize America,” said Jensen Huang, Founder and CEO of NVIDIA. “Amkor’s new Arizona facility is a defining milestone in bringing this capability home. Together, we are rebuilding the supply chain — onshoring the AI technology stack that turns energy into intelligence and secures America’s leadership for the AI century.”

“This new Amkor facility groundbreaking represents a testament to what is possible when industry leaders share a common vision and work together to build a resilient, end-to-end supply chain right here in the U.S.,” said Jun He, vice president, Advanced Packaging Technology and Service at TSMC. “Our collaboration in Arizona will provide customers with a streamlined, domestic ecosystem, designed to help define the future of local semiconductor manufacturing.”

About Amkor Technology, Inc.

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S.-headquartered outsourced semiconductor assembly and test (OSAT) provider and a global leader in advanced packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint, and partnerships with leading customers, Amkor delivers high-quality solutions that enable the world’s top semiconductor and electronics companies to bring advanced technologies to market. Its portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions for applications spanning smartphones, data centers, artificial intelligence, automotive, and wearables. For more information, please click here.

Source/Photo Credit and Copyright: Amkor Technology, Inc. 


(Editor’s Note: All trademarks mentioned in this article, including company names, product names, and logos, are the property of their respective owners. Use of these trademarks is for informational purposes only and does not imply any endorsement.)

Molly Bakewell Chamberlin
Tagged