Cirrus Logic, a developer of low-power analog and mixed-signal semiconductor solutions, has received a research and development grant from Scottish Enterprise to support the development of a new metrology analog front-end platform for smart energy applications. The project will also expand the company’s advanced engineering activities in Edinburgh, Scotland. The value of the grant was […]
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Astera Labs, global industry experts in semiconductor-based connectivity solutions for rack-scale AI infrastructure, has expanded its 200G Taurus family with new 3.2T Smart Retimers and Smart Redrivers for scale-up and scale-out AI systems. The footprint-compatible, 16-lane devices support 200G-per-lane Ethernet, UALink and ESUN connectivity. They are designed to help hyperscalers, neoclouds, AI system providers and […]
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Blumind, a developer of ultra-low-power analog AI chips for edge computing, has secured $20M CAD in Series A funding to advance the development and commercialization of its AMPL™ technology platform.
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Würth Elektronik has announced the global market introduction of its WL-ICLED series, a cutting-edge series of RGB LEDs with integrated controllers (ICs). These components, functioning as individual pixels, incorporate red, green, and blue LEDs alongside a programmable controller IC. Offering four distinct designs, these intelligent LEDs afford precise control over pixel color and brightness levels […]
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TDK Intros Automotive Inductors for High-Frequency Circuits The Tokyo, Japan-based TDK Corporation (TSE:6762), world experts in electronic solutions for the smart society, has announced the launch of its MHQ1005075HA inductor series for high-frequency automotive circuits. Inductors for high-frequency circuits for automotive or infrastructure use must meet higher standards for safety and reliability. This includes design […]
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Siemens Certifies Industry-Leading IC Design Solutions for Intel Foundry Processes Siemens Digital Industries Software has announced the certification of its Calibre® nmPlatform tool and Analog FastSPICE (AFS) platform for Intel 18A and Intel 16 process technologies. Intel 18A, equipped with RibbonFET Gate-All-Around (GAA) transistor architecture and PowerVia backside power delivery technologies, significantly advances Intel Foundry’s […]
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