Semiconductor Industry Monthly image of advanced AI semiconductor packaging technologies from Applied Materials and Broadcom

Applied Materials, Broadcom Collaborate on AI Chip Packaging

Applied Materials and Broadcom have announced a new collaboration on advanced semiconductor packaging technologies intended to support next-generation AI chips and high-performance computing systems. The collaboration will involve research and development activities across Applied Materials’ global network of semiconductor innovation centers, including the company’s new EPIC Center currently under development in Silicon Valley.

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Close-up of a computer chip labeled 'AI', surrounded by intricate circuit pathways and glowing elements.

Empower Semiconductor Raises $140M for AI Power Delivery

Empower Semiconductor announced it has closed more than $140 million in Series D financing. The round was led by Fidelity Management & Research Company with participation from Maverick Silicon, CapitalG, Atreides Management, Socratic Partners, Walden Catalyst Ventures, Knollwood, and a wholly owned subsidiary of the Abu Dhabi Investment Authority (ADIA). Barclays Capital served as exclusive […]

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Microchip Technology Acquires Neuronix AI Labs

Microchip Technology Acquires Neuronix AI Labs

Microchip Technology (Nasdaq: MCHP) has recently announced its acquisition of Neuronix AI Labs to enhance its power-efficient, AI-enabled edge solutions deployed on field-programmable gate arrays (FPGAs). Neuronix AI Labs specializes in neural networ k sparsity optimization, a technology that reduces power consumption, size, and computational requirements for tasks like image classification, object detection, and semantic […]

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