Semiconductor Industry Monthly chip graphic illustrating the proposed GlobalFoundries silicon photonics and advanced packaging R&D program.

GlobalFoundries Signs $300 Million Silicon Photonics LOI

August 2026 Molly Bakewell Chamberlin

GlobalFoundries has signed a letter of intent with the U.S. Department of Commerce for an expected $300 million CHIPS Research and Development award supporting next-generation silicon photonics. The proposed funding would advance the company’s development of optical materials, silicon photonics wafer technologies and advanced packaging for artificial intelligence and high-performance computing infrastructure. The letter of […]

U.S. Establishes Investment Accelerator to Oversee CHIPS Office

April 2025May 23, 2025 Molly Bakewell Chamberlin

On March 31, 2025, the White House announced that U.S. President Donald J. Trump had signed an Executive Order establishing the United States Investment Accelerator, a new office within the U.S. Department

Purely decorative image appearing in an article on Semiconductor Industry Monthly entitled ASU Research Park Selected for Advanced U.S. Semiconductor R&D Facility

ASU Research Park Selected for Advanced U.S. Semiconductor R&D Facility

January 2025January 19, 2025 Molly Bakewell Chamberlin

The U.S. Department of Commerce and Natcast have announced the Arizona State University (ASU) Research Park in Tempe, Arizona, as the site for the third flagship CHIPS for America R&D facility. This state-of-the-art facility will house the National

Purely decorative image appearing in an article on Semiconductor Industry Monthly entitled TI Secures $1.6B in CHIPS Act Funding for Texas, Utah Expansions

TI Secures $1.6B in CHIPS Act Funding for Texas, Utah Expansions

December 2024January 13, 2025 Molly Bakewell Chamberlin

Texas Instruments (TI) has announced that it is the recipient of up to $1.6 billion in funding from the U.S. Department of Commerce under the CHIPS Act. The funding will support three new 300mm semiconductor wafer fabs currently under construction in Sherman, Texas, and Lehi, Utah.

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Bosch Awarded $225M in CHIPS Act Funding for SiC Chip Production

December 2024January 13, 2025 Molly Bakewell Chamberlin

Bosch, a global leader in semiconductor and automotive technologies, has signed a preliminary memorandum of terms (PMT) with the U.S. Department of Commerce, securing up to $225 million in proposed direct funding under the CHIPS and Science Act. This funding will support Bosch’s

Purely decorative image appearing in an article on Semiconductor Industry Monthly entitled Ayar Labs Secures $155M to Scale Optical Interconnects for AI

Ayar Labs Secures $155M to Scale Optical Interconnects for AI

December 2024January 13, 2025 Molly Bakewell Chamberlin

Ayar Labs, global experts in optical interconnect solutions for large-scale AI workloads, has announced that it has successfully raised $155 million in Series D funding address the bottlenecks in data movement for AI infrastructure with its optical I/O technology.