Amkor Technology, Inc. has broken ground on its new state-of-the-art outsourced advanced packaging and test campus in Arizona. The company announced that its total investment for the project has expanded to $7 billion across two phases. This includes additional cleanroom space and a second greenfield packaging and test facility, marking a more than $5 billion […]
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Bosch, a global leader in semiconductor and automotive technologies, has signed a preliminary memorandum of terms (PMT) with the U.S. Department of Commerce, securing up to $225 million in proposed direct funding under the CHIPS and Science Act. This funding will support Bosch’s
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Ayar Labs, global experts in optical interconnect solutions for large-scale AI workloads, has announced that it has successfully raised $155 million in Series D funding address the bottlenecks in data movement for AI infrastructure with its optical I/O technology.
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The U.S. Department of Commerce has announced its award of up to $406 million in CHIPS Act funding to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co., Ltd. (GlobalWafers), under its CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
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