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Bosch Awarded $225M in CHIPS Act Funding for SiC Chip Production

December 2024January 13, 2025 Molly Bakewell Chamberlin

Bosch, a global leader in semiconductor and automotive technologies, has signed a preliminary memorandum of terms (PMT) with the U.S. Department of Commerce, securing up to $225 million in proposed direct funding under the CHIPS and Science Act. This funding will support Bosch’s

Purely decorative image appearing in an article on Semiconductor Industry Monthly entitled TOPPAN Joins US-Japan Next-Gen Semiconductor Packaging Collaboration

TOPPAN Joins US-JOINT for Next-Gen Semiconductor Packaging Advancements

December 2024January 13, 2025 Molly Bakewell Chamberlin

TOPPAN Inc., a wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has announced its participation in US-JOINT, a US-Japan consortium dedicated to advancing next-generation semiconductor packaging.

Purely decorative image, appearing on Electronics Industry Monthly in an article entitled IBM Pioneers Co-Packaged Optics with PWG for AI Data Centers.

IBM Pioneers Co-Packaged Optics with PWG for AI Data Centers

December 2024June 25, 2025 Molly Bakewell Chamberlin

IBM has unveiled a breakthrough in co-packaged optics (CPO) technology, leveraging polymer optical waveguides (PWG) to significantly enhance AI data center performance. This advancement represents the first successful implementation of PWG to support CPO, as detailed in IBM Research’s recently published technical paper. The innovation enables high-bandwidth optical connectivity, offering faster AI model training, improved […]

Photo of new five new half-bridge industrial-grade IGBT power modules, housed within a newly redesigned INT-A-PAK package, and designed for reduced conduction and switching losses, appearing in an article in Electronics Industry Monthly.

Vishay Intros Next-Gen High-Efficiency IGBT Power Modules

February 2024December 8, 2024 Molly Bakewell Chamberlin

Vishay Intros Next-Gen High-Efficiency IGBT Power Modules for Reduced Conduction and Switching Losses The Malvern, Pennsylvania-based Vishay Intertechnology (NYSE: VSH), a global designer and manufacturer of discrete semiconductors and passive electronic components, has introduced five new half-bridge industrial-grade IGBT power modules, housed within a newly redesigned INT-A-PAK package, and designed for reduced conduction and switching […]

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Siemens Certifies IC Design for Intel Foundry Processes

February 2024June 25, 2025 Molly Bakewell Chamberlin

Siemens Certifies Industry-Leading IC Design Solutions for Intel Foundry Processes Siemens Digital Industries Software has announced the certification of its Calibre® nmPlatform tool and Analog FastSPICE (AFS) platform for Intel 18A and Intel 16 process technologies. Intel 18A, equipped with RibbonFET Gate-All-Around (GAA) transistor architecture and PowerVia backside power delivery technologies, significantly advances Intel Foundry’s […]