X-FAB Silicon Foundries SE, a leader in analog/mixed-signal and specialty semiconductor manufacturing, has introduced XSICM03, the company’s next-generation XbloX platform for Silicon Carbide (SiC) power MOSFETs. This advanced platform delivers a significant reduction in cell pitch, increasing die per wafer while improving on-state resistance and maintaining robust reliability.
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Power Integrations, a provider of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has introduced a wide-creepage package option for its InnoSwitch™3-AQ flyback automotive switcher IC, designed to meet the stringent requirements of next-generation EVs.
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CEA-Leti researchers have developed the first device capable of both sensing and modulating light within a single unit. This innovation integrates a liquid crystal cell with a CMOS image sensor, enabling a compact and scalable system with intrinsic optical alignment. The breakthrough is expected to drive the adoption of digital optical phase conjugation (DOPC) techniques […]
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IBM has unveiled a breakthrough in co-packaged optics (CPO) technology, leveraging polymer optical waveguides (PWG) to significantly enhance AI data center performance. This advancement represents the first successful implementation of PWG to support CPO, as detailed in IBM Research’s recently published technical paper. The innovation enables high-bandwidth optical connectivity, offering faster AI model training, improved […]
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