Semiconductor Industry Monthly image of advanced AI semiconductor packaging technologies from Applied Materials and Broadcom

Applied Materials, Broadcom Collaborate on AI Chip Packaging

May 2026 Molly Bakewell Chamberlin

Applied Materials and Broadcom have announced a new collaboration on advanced semiconductor packaging technologies intended to support next-generation AI chips and high-performance computing systems. The collaboration will involve research and development activities across Applied Materials’ global network of semiconductor innovation centers, including the company’s new EPIC Center currently under development in Silicon Valley.

sureCore Expands AI-Focused Memory Design Services

May 2025June 25, 2025 Molly Bakewell Chamberlin

sureCore, global industry experts in ultra-low power embedded memory solutions, has expanded its sureFIT™ custom memory design service to address the evolving requirements of AI chip developers. This initiative is aimed at further supporting performance

SandboxAQ Scales LQMs Using NVIDIA DGX Cloud for Discovery

April 2025June 25, 2025 Molly Bakewell Chamberlin

SandboxAQ has announced a collaboration with NVIDIA to accelerate breakthroughs in biopharmaceuticals, chemicals, advanced materials, financial services, cybersecurity, navigation, and medical imaging. A member of the NVIDIA Inception program, SandboxAQ is

Ayar Labs Introduces UCIe™ Optical Interconnect Chiplet for AI Systems

April 2025June 25, 2025 Molly Bakewell Chamberlin

Ayar Labs has announced the introduction of the industry’s first Universal Chiplet Interconnect Express™ (UCIe™) optical interconnect chiplet, designed to maximize performance and efficiency in AI infrastructures by significantly reducing latency