Socionext Inc., global industry experts in System-on-Chip (SoC) design and advanced semiconductor solutions, has introduced a new class of configurable chiplets engineered to support the demands of next-generation multi-die systems and heterogeneous integration. As monolithic SoC designs approach physical and economic limits — such as reticle size constraints, yield challenges, and thermal bottlenecks —the semiconductor […]
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X-FAB Silicon Foundries SE, a leader in analog/mixed-signal and specialty semiconductor manufacturing, has introduced XSICM03, the company’s next-generation XbloX platform for Silicon Carbide (SiC) power MOSFETs. This advanced platform delivers a significant reduction in cell pitch, increasing die per wafer while improving on-state resistance and maintaining robust reliability.
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In the fast-evolving landscape of IoT (Internet of Things) technology, the demand for seamless wireless connectivity solutions continues to surge. Addressing this need, Murata, a leading provider of electronic components, has introduced its latest innovation, the Type 2GT module. Per the company’s website, a multi-band, low-power LoRa® module represents a significant leap forward in IoT […]
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Triad Semiconductor, Inc. (Triad) has announced the establishment of Triad Micro Devices (TMD), a specialized ‘pure-play’ division dedicated to the development of analog and mixed-signal integrated circuits (ICs) specifically for the aerospace and defense sector. With a focus on innovation, TMD specializes in delivering advanced, integrated, and high-reliability analog and mixed-signal solutions tailored for both […]
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