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About Multibeam Corp.

Multibeam Corp., global industry experts in multicolumn e-beam lithography (MEBL), is pioneering production-grade, maskless patterning systems designed to accelerate semiconductor innovation. Headquartered in Silicon Valley, the company has developed the industry’s first high-throughput MEBL platform specifically engineered for volume manufacturing of advanced node and advanced packaging applications.

Multibeam’s differentiated platform architecture supports full-wafer and panel-level lithography with exceptional depth of focus, large field of view, and the unique capability to write distinct patterns without masks. These features enable high-productivity, high-precision direct-write lithography suited for chiplet integration, heterogeneous packaging, and rapid prototyping—areas where traditional optical lithography methods often fall short.

Applications for Multibeam’s technology span a wide range of high-growth sectors, including photonics, quantum computing, MEMS, compound semiconductors, and power devices. The company’s solutions are already being adopted by global semiconductor manufacturers seeking agile, scalable alternatives to traditional lithography for next-generation designs. As demand intensifies for faster time-to-market and greater design flexibility in AI, 3D ICs, and advanced systems, Multibeam’s technology is positioned to unlock new pathways in device architecture and silicon innovation.

For more information, please visit www.multibeamcorp.com.

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