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# Semiconductor Industry Monthly: Semiconductor Industry Monthly is a global B2B e-news platform delivering the latest innovations, insights, and trends in semiconductor research and development, advanced manufacturing, university research, and commercial fab operations.

Our editorial coverage spans design, engineering, process control, component distribution, electronic components, materials science, and sensors, as well as applications across electronics, aerospace, automotive, industrial automation, and emerging technologies such as silicon photonics, industrial AI, MEMS and nanotechnology, and quantum. We maintain a strong commitment to small business advocacy, supply chain diversity, and sustainable innovation throughout the semiconductor ecosystem.

Published on the Components Source Network, Powered by Embassy Global, LLC — the world’s first and only 100% woman-founded, -owned, and -led publishing and consultancy network (WBE/WOSB/DOBE certified) serving the high-tech manufacturing and engineering sectors — Semiconductor Industry Monthly connects a global network of engineers, executives, and innovators through trusted, expert-driven content designed to educate, inform, and empower.

As part of a growing portfolio of 11 specialized e-news sites, Semiconductor Industry Monthly contributes to a living data ecosystem that informs key industry stakeholders, public and private sector leaders, and academia. Together, our publications advance awareness, advocacy, and sustainable innovation across the global supply chain.

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## Posts
- [Agentrys Raises $24.5M for AI Chip Design Automation](https://semiconductorindustrymonthly.com/agentrys-raises-24-5m-for-ai-chip-design-automation/): Agentrys has raised $24.5 million to expand development of its AI-based chip design automation platform and customer programs across verification and physical design. The funding includes an oversubscribed $19.1 million seed round led by Etna Labs, following a $5.4 million pre-seed round led by MediaTek, the company’s first strategic backer. Agentrys plans to use the new capital for recruiting, agent-native tooling and expansion of customer engagements. Rather than target a single EDA task, Agentrys is developing what it calls Agentic Design Automation, or ADA, an approach designed to automate and improve complete semiconductor engineering workflows. The company’s platform allows design teams to build and retain their own AI agent systems across commercial EDA tools, internal tools and existing design infrastructure instead of relying exclusively on a fixed set of vendor-controlled agents.
- [ACM Research Expands Wet Processing Platform](https://semiconductorindustrymonthly.com/acm-research-expands-wet-processing-platform/): ACM Research, a supplier of wafer and panel processing equipment for semiconductor and advanced packaging applications, has expanded its Ultra C Tahoe system into a multi-process wet processing platform, adding advanced wet etch and monitor wafer reclaim capabilities for logic and memory manufacturing. Built around ACM’s hybrid wet processing architecture, the platform combines batch and single-wafer processes within a common system, supporting the longer process times and reduced chemical consumption associated with batch cleaning while retaining the high particle removal efficiency, reduced wafer-to-wafer cross-contamination and precise process-time control of single-wafer cleaning.
- [Lam Research Plans $3B Global R&D Lab Expansion](https://semiconductorindustrymonthly.com/lam-research-plans-3b-global-rd-lab-expansion/): Lam Research, a global supplier of wafer fabrication equipment for semiconductor manufacturing, plans to invest more than $3 billion over the next five years to expand its global research and development lab network, adding infrastructure and capabilities expected to increase experiment capacity by more than 50% as semiconductor manufacturers address new device architectures, materials and increasingly complex nanoscale features. Spanning the United States, Asia and Europe, Lam’s global R&D network currently supports more than one million experiments annually through specialized facilities designed to address different stages of the semiconductor innovation cycle, including laboratories focused on foundational research involving new chemistries, materials and mechatronics, as well as process development facilities that move emerging technologies toward production readiness.
- [Micron Technology Plans $10B U.S. Memory Research Hub](https://semiconductorindustrymonthly.com/micron-technology-plans-10b-u-s-memory-research-hub/): Micron Technology, Inc., a global semiconductor company specializing in memory and storage solutions, has announced plans to establish Micron Research Labs, a U.S.-based long-horizon research institution headquartered in Boise, Idaho, and backed by a planned $10 billion investment over the next decade. The new research hub will focus on critical memory technologies, advanced memory and compute architectures, packaging and future semiconductor manufacturing.
- [Infineon Acquires C2i Semiconductors](https://semiconductorindustrymonthly.com/infineon-acquires-c2i-semiconductors/): Infineon Technologies AG, a global semiconductor manufacturer focused on power systems and IoT, has announced its acquisition of C2i Semiconductors, a Bangalore, India-based developer of software-defined multiphase controllers and smart power stages for AI data center applications. The acquisition will add C2i Semiconductors’ digital power management and system-level power architecture capabilities to Infineon’s existing portfolio of power semiconductors and power systems. C2i’s technology is designed to support power delivery from grid to core for AI servers and high-performance computing platforms, including next-generation vertical power delivery architectures and Substrate Integrated Voltage Regulators, or SIVR.
- [ZEISS SMT Expands Semiconductor Capacity in Oberkochen](https://semiconductorindustrymonthly.com/zeiss-smt-expands-semiconductor-capacity-in-oberkochen/): Oberkochen is central to ZEISS SMT’s development and production of technologies used during critical semiconductor manufacturing processes. Its portfolio includes high-precision optics for lithography systems such as High-NA EUV, as well as systems for the production, qualification and repair of photomasks. ZEISS SMT also develops wafer inspection, metrology and defect analysis solutions and supports advanced packaging processes that combine multiple chips and functions within highly integrated systems.
- [Veolia Secures €343 Million in Semiconductor Bookings](https://semiconductorindustrymonthly.com/veolia-secures-e343-million-in-semiconductor-bookings/): Veolia, a global specialist in water and wastewater technologies, has recorded €343 million in microelectronics bookings since the beginning of 2026. The total includes two semiconductor manufacturing contracts valued at a combined €243 million for ultrapure water production in Singapore and advanced wastewater reclamation in the United States. The first contract will provide ultrapure water for a new semiconductor fabrication facility in Singapore, while the second will deliver advanced wastewater reclamation and zero liquid discharge treatment at a manufacturing campus in the United States. Veolia did not identify the semiconductor customer or disclose the individual value of either contract.
- [GlobalFoundries Signs $300 Million Silicon Photonics LOI](https://semiconductorindustrymonthly.com/globalfoundries-signs-300-million-silicon-photonics-loi/): GlobalFoundries has signed a letter of intent with the U.S. Department of Commerce for an expected $300 million CHIPS Research and Development award supporting next-generation silicon photonics. The proposed funding would advance the company’s development of optical materials, silicon photonics wafer technologies and advanced packaging for artificial intelligence and high-performance computing infrastructure. The letter of intent represents an expected award rather than completed funding.
- [FormFactor, Keystone Microtech Expand Partnership](https://semiconductorindustrymonthly.com/formfactor-keystone-microtech-expand-partnership/): FormFactor, a provider of semiconductor test and measurement technologies, and Keystone Microtech have expanded their strategic partnership to support the manufacturing and delivery of advanced probe card solutions. The agreement combines FormFactor’s probe card technology and semiconductor test expertise with Keystone Microtech’s design, assembly, testing, repair and distribution capabilities in Taiwan. The expanded partnership is intended to increase manufacturing scalability and strengthen regional support for semiconductor manufacturers developing devices for artificial intelligence, high-performance computing, advanced packaging, memory and high-speed connectivity applications. These technologies are creating more demanding production test requirements as device architectures become increasingly complex.
- [Cirrus Logic Receives Scottish Grant for Smart Energy AFE](https://semiconductorindustrymonthly.com/cirrus-logic-receives-scottish-grant-for-smart-energy-afe/): Cirrus Logic, a developer of low-power analog and mixed-signal semiconductor solutions, has received a research and development grant from Scottish Enterprise to support the development of a new metrology analog front-end platform for smart energy applications. The project will also expand the company’s advanced engineering activities in Edinburgh, Scotland. The value of the grant was not disclosed. The project is scheduled to continue through 2028 and will support the development of core intellectual property for residential, commercial and industrial energy metering. Intended applications include EV charging, data center DC metrology, energy storage and electrical grid monitoring.
- [Acrab Introduces Edge AI SoC](https://semiconductorindustrymonthly.com/acrab-introduces-edge-ai-soc/): Acrab, a developer of agentic AI computing infrastructure, has introduced its first-generation GΞLIX 1 edge AI system-on-chip together with Agent Box, a personal edge AI system built on the company’s computing platform. The company said the SoC is manufactured using a 5 nm process and designed to support local inference for open-source AI models in the 100-billion-parameter class.
- [Solstice Advanced Materials to Acquire Element Solutions in $14.5B Deal](https://semiconductorindustrymonthly.com/solstice-advanced-materials-to-acquire-element-solutions-in-14-5b-deal/): Solstice Advanced Materials, a global specialty materials company, has entered into a definitive agreement to acquire Element Solutions in a cash-and-stock transaction valued at approximately $14.5 billion, including the assumption of net debt.  The proposed combination would create a broader advanced materials platform spanning semiconductor fabrication, advanced packaging and electronics assembly. It would also connect those capabilities with materials and refrigerant application solutions for chip thermal management and data center cooling.
- [Linde Plans $1 Billion Semiconductor Gas Expansion](https://semiconductorindustrymonthly.com/linde-plans-1-billion-semiconductor-gas-expansion/): Linde, a global industrial gases and engineering company, has announced plans to invest $1 billion in the expansion of its on-site industrial gas production complex in Phoenix, Arizona. The investment follows a new long-term agreement to supply ultra-high-purity industrial gases to one of the world’s largest semiconductor manufacturers. Linde has not publicly identified the customer.
- [About Featured Expert: Brewer Science](https://semiconductorindustrymonthly.com/about-featured-expert-brewer-science/): Brewer Science are global industry experts in advanced semiconductor materials and processes, developing and manufacturing enabling materials for lithography, thin-wafer handling, advanced packaging and microdevice fabrication.  Founded in 1981 by Dr. Terry Brewer, the company established its semiconductor industry presence through its development of antireflective coating materials. Its current lithography portfolio spans top and bottom antireflective coatings, extreme ultraviolet materials, spin-on-carbon and silicon-containing hardmask materials, gap-filling and planarization materials and multilayer patterning systems.
- [Astera Labs Expands Smart Signal Conditioner Family](https://semiconductorindustrymonthly.com/astera-labs-expands-smart-signal-conditioner-family/): Astera Labs, global industry experts in semiconductor-based connectivity solutions for rack-scale AI infrastructure, has expanded its 200G Taurus family with new 3.2T Smart Retimers and Smart Redrivers for scale-up and scale-out AI systems. The footprint-compatible, 16-lane devices support 200G-per-lane Ethernet, UALink and ESUN connectivity. They are designed to help hyperscalers, neoclouds, AI system providers and network platform providers scale denser AI clusters, optimize system-level power consumption and maintain accelerator utilization as infrastructure architectures evolve.
- [About Featured Expert: NHanced Semiconductors](https://semiconductorindustrymonthly.com/about-featured-expert-nhanced-semiconductors/): NHanced Semiconductors (NHanced), a wholly owned subsidiary of Quantum Computing Inc. (QCi), are U.S. industry experts in advanced semiconductor packaging. The company provides comprehensive back-end-of-line foundry services for high-mix, low-to-medium-volume requirements, supporting customers from individual unit processes through wafer-level turnkey manufacturing. Their advanced packaging capabilities include chiplet integration, hybrid bonding, heterogeneous integration, silicon interposers and 2.5D and 3D device architectures. NHanced supports wafer-to-wafer, die-to-wafer, die-to-die and chiplet-to-interposer integration, with face-to-face, face-to-back and back-to-back configurations.
- [Micross Components to Acquire AEMtec for Advanced Packaging](https://semiconductorindustrymonthly.com/micross-components-to-acquire-aemtec-for-advanced-packaging/): Micross Components (Micross), global industry experts in high-reliability microelectronic products and services, has entered into a definitive agreement to acquire AEMtec GmbH, expanding its advanced packaging, photonics, optoelectronics and test capabilities while establishing its first scaled presence in continental Europe.
- [Intel and Fortinet Collaborate on SP6 Security Processor](https://semiconductorindustrymonthly.com/intel-and-fortinet-collaborate-on-sp6-security-processor/): Intel Corporation, global industry experts in semiconductor design and manufacturing, and Fortinet, global industry experts in cybersecurity and secure networking, have entered into a strategic collaboration to develop the Fortinet Security Processor 6, or SP6. The collaboration combines Fortinet’s purpose-built security processor expertise with Intel’s advanced semiconductor design, packaging and manufacturing capabilities.
- [ASML High NA EUV System Begins Arriving at Albany NanoTech](https://semiconductorindustrymonthly.com/asml-high-na-euv-system-begins-arriving-at-albany-nanotech/): The first major components of ASML’s High NA extreme ultraviolet lithography system have arrived at NY Creates’ Albany NanoTech Complex, marking another step toward establishing North America’s first accessible High NA EUV Lithography Center. The delivery includes the bottom main module of the ASML TWINSCAN EXE:5200B system. Additional components are scheduled to arrive throughout the summer, with installation progressing during 2026.
- [Siemens, Cloudberry VC Partner on European Deep-Tech Innovation](https://semiconductorindustrymonthly.com/siemens-cloudberry-vc-partner-on-european-deep-tech-innovation/): Siemens Digital Industries Software has announced a collaboration between Siemens Cre8Ventures and Cloudberry VC to help accelerate the commercialization of European deep-tech innovation. The collaboration combines the industrial validation and customer access capabilities of Siemens Cre8Ventures with Cloudberry VC’s venture capital expertise in semiconductors, photonics and advanced materials.
- [About Featured Expert: Axcelis Technologies](https://semiconductorindustrymonthly.com/about-featured-expert-axcelis-technologies/): Axcelis Technologies are global industry experts in ion implantation equipment, semiconductor process engineering and lifecycle support for advanced wafer manufacturing. The company designs, develops and manufactures systems used to introduce controlled dopants and other species into semiconductor wafers. Implant dose, energy, depth and angle help establish the electrical characteristics of the finished device, while particle and metallic-contamination control remain essential to process stability across advanced and mature semiconductor manufacturing.
- [About Featured Expert: Polar Semiconductor](https://semiconductorindustrymonthly.com/about-featured-expert-polar-semiconductor/): Polar Semiconductor are global industry experts in high-voltage, power and sensor semiconductor manufacturing. The company operates a U.S.-based, 200 mm specialty foundry in Bloomington, Minnesota, with deep experience in automotive-grade wafer fabrication. Its manufacturing model is centered on differentiated semiconductor technologies that must deliver consistent electrical performance, long-term reliability and repeatable high-volume production across demanding end-use environments.
- [About Featured Expert: SkyWater Technology](https://semiconductorindustrymonthly.com/about-featured-expert-skywater-technology/): SkyWater Technology are global industry experts in semiconductor technology development, U.S.-based foundry manufacturing, advanced packaging and trusted microelectronics production. The company operates a pure-play semiconductor foundry model designed for technologies that require more than access to a standardized manufacturing platform. Through its Technology as a Service approach, SkyWater works with customers during process development, manufacturing scale-up, qualification, volume production and heterogeneous integration.
- [About Featured Expert: Atomera](https://semiconductorindustrymonthly.com/about-featured-expert-atomera/): Atomera are global industry experts in advanced semiconductor materials, transistor-performance enhancement, process integration and technology licensing. The company develops and licenses Mears Silicon Technology, or MST, a thin-film materials technology designed to improve semiconductor device performance and power efficiency. MST incorporates precisely controlled layers of a non-semiconductor material, such as oxygen, within semiconductor material such as silicon while preserving the epitaxial structure required for device fabrication.
- [About Featured Expert: PDF Solutions](https://semiconductorindustrymonthly.com/about-featured-expert-pdf-solutions/): PDF Solutions are global industry experts in semiconductor manufacturing analytics, equipment connectivity, process control, test operations and supply-chain data intelligence. The company develops software and data infrastructure designed to connect information generated across semiconductor manufacturing, assembly, packaging and test. Its technologies help foundries, integrated device manufacturers, fabless companies, OSATs and equipment suppliers bring data from different tools, factories and business systems into a common environment where it can be analyzed and used to improve yield, quality, cost and operational performance.
- [About Featured Expert: Onto Innovation](https://semiconductorindustrymonthly.com/about-featured-expert-onto-innovation/): Onto Innovation are global industry experts in semiconductor inspection, metrology, advanced-packaging lithography and manufacturing analytics. The company develops process-control technologies that help semiconductor manufacturers identify variation, determine where it originated and understand how it may affect yield, device performance, quality or reliability. Its portfolio combines inspection and measurement systems with analytical software, allowing information collected at individual process steps to be evaluated within the wider manufacturing flow.
- [JEDEC Releases New SiC Reliability Guidelines](https://semiconductorindustrymonthly.com/jedec-releases-new-sic-reliability-guidelines/): JEDEC Solid State Technology Association has released two publications addressing short-circuit evaluation and reliability stress procedures for silicon carbide power semiconductor devices. Developed by the JEDEC JC-70.2 Silicon Carbide Subcommittee, JEP203: Guideline for Short Circuit Evaluation in Power Conversion Transistors and JEP204: Catalog of Stress Procedures for Silicon Carbide Devices for Power Electronic Conversion are intended to support more consistent evaluation of SiC devices used in power conversion systems.
- [Architect Labs Raises $24M to Advance AI-Assisted Custom Chip Design](https://semiconductorindustrymonthly.com/architect-labs-raises-24m-to-advance-ai-assisted-custom-chip-design/): Architect Labs, a Palo Alto, California-based company focused on accelerating custom silicon development, has emerged from stealth with $24 million in seed funding. The round was led by Kindred Ventures, with participation from TQ Ventures, Race Capital, Together Fund, and individual investors from across the computing, semiconductor, and artificial intelligence ecosystem. Kindred Ventures founder and managing partner Steve Jang has joined Architect Labs’ board.
- [Siemens, Samsung Foundry Advance EDA Collaboration](https://semiconductorindustrymonthly.com/siemens-samsung-foundry-advance-eda-collaboration/): Siemens and Samsung Foundry are continuing their collaboration on advanced semiconductor design and manufacturing workflows, with a focus on electronic design automation, photonic integrated circuit verification, design-for-test, advanced packaging, analog and RF verification, and digital implementation.
- [Featured Expert: d-Matrix](https://semiconductorindustrymonthly.com/featured-expert-d-matrix/): Founded in Silicon Valley, d-Matrix develops AI inference computing technologies designed for interactive, low-latency artificial intelligence workloads operating within large-scale data center environments. The company focuses specifically on inference acceleration architectures intended to support real-time generative AI applications, conversational AI systems, and large language model (LLM) deployments requiring high throughput, reduced latency, and improved energy efficiency.
- [Applied Materials, Broadcom Collaborate on AI Chip Packaging](https://semiconductorindustrymonthly.com/applied-materials-broadcom-collaborate-on-ai-chip-packaging/): Applied Materials and Broadcom have announced a new collaboration on advanced semiconductor packaging technologies intended to support next-generation AI chips and high-performance computing systems.
- [SEMI Urges Extension of U.S. Manufacturing Credit](https://semiconductorindustrymonthly.com/semi-urges-extension-of-u-s-manufacturing-credit/): SEMI, the global semiconductor industry association representing the electronics design and manufacturing supply chain, and 23 member companies have urged the U.S. Congress to approve a multi-year extension of the Advanced Manufacturing Investment Credit (AMIC), citing its importance to continued domestic semiconductor investment and supply chain expansion.
- [Siemens Unveils AI Semiconductor Characterizer](https://semiconductorindustrymonthly.com/siemens-unveils-ai-semiconductor-characterizer/): Siemens has introduced Solido Characterizer software, an AI-powered semiconductor library characterization platform designed to accelerate Liberty file generation and support advanced semiconductor design workflows across multiple process nodes. 
- [Renesas Expands Embedded Vision AI with Irida Labs Software](https://semiconductorindustrymonthly.com/renesas-expands-embedded-vision-ai-with-irida-labs-software/): Renesas Electronics Corporation, global industry experts in embedded processing, microcontrollers, and semiconductor system solutions, has announced completion of its acquisition of the Greece-based Irida Labs, a developer of embedded software technologies for AI-powered visual perception systems.
- [CHARBONE Opens First U.S. Industrial Gas Hub in Albany, NY](https://semiconductorindustrymonthly.com/charbone-opens-first-u-s-industrial-gas-hub-in-albany-ny/): CHARBONE Corporation, developers of ultra-high purity industrial gas infrastructure for semiconductor, AI, aerospace and advanced manufacturing applications, announced the opening of its first U.S. supply hub in Albany, New York.
- [Infineon and d-Matrix Advance AI Inferencing Efficiency](https://semiconductorindustrymonthly.com/infineon-and-d-matrix-advance-ai-inferencing-efficiency/): Infineon Technologies AG, global industry experts in power semiconductors, AI power delivery, and energy-efficient semiconductor technologies, has announced a collaboration with AI inference computing company d-Matrix focused on optimizing performance, power efficiency, and system integration for interactive AI inferencing platforms used in data center environments.
- [Featured Expert: Micron Technology](https://semiconductorindustrymonthly.com/featured-expert-micron-technology/): Micron Technology, Inc. is a U.S.-based semiconductor manufacturer headquartered in Boise, Idaho, specializing in memory and storage technologies. The company designs and manufactures dynamic random-access memory (DRAM), NAND flash memory, and NOR memory products used across a wide range of computing and embedded applications.
- [Featured Expert: ASE Technology Holding](https://semiconductorindustrymonthly.com/featured-expert-ase-technology-holding/): ASE Technology Holding Co., Ltd. (ASEH) is a leading provider of outsourced semiconductor assembly and test (OSAT) services headquartered in Kaohsiung, Taiwan. ASEH supports semiconductor manufacturers with package design, assembly, and electrical and reliability testing for integrated circuits.
- [Featured Expert: Avnet](https://semiconductorindustrymonthly.com/featured-expert-avnet/): Avnet, Inc. is a global distributor of electronic components and embedded technologies headquartered in the United States. The company supplies semiconductors, passive and electromechanical components, interconnects, and system-level platforms used across electronic design and production.
- [Featured Expert: imec](https://semiconductorindustrymonthly.com/featured-expert-imec/): imec is an independent, international research and development organization headquartered in Leuven, Belgium, focused on advancing semiconductor and digital technologies. The institute conducts applied R&D across semiconductor device architectures, process integration, lithography enablement, advanced packaging, heterogeneous integration, and related areas that influence future manufacturing roadmaps.
- [Featured Expert: KLA](https://semiconductorindustrymonthly.com/featured-expert-kla-x/): KLA Corporation is a supplier of semiconductor process control and yield management systems headquartered in Milpitas, California, USA. The company’s portfolio includes inspection tools, metrology systems, and computational analytics used to monitor wafer fabrication and advanced packaging operations.
- [Featured Expert: GlobalFoundries](https://semiconductorindustrymonthly.com/featured-expert-globalfoundries-x/): GlobalFoundries (GF) is a pure-play semiconductor foundry headquartered in Malta, New York, USA. Formed in 2009 to operate foundry services independent of a single device brand, GF provides wafer manufacturing for semiconductor companies across a range of process technologies including specialty, RF, power, and mature logic nodes.
- [Featured Expert: Soitec](https://semiconductorindustrymonthly.com/featured-expert-soitec/): Soitec is a semiconductor materials company headquartered in Bernin, France, specializing in engineered substrates that serve as the foundational materials for device fabrication. Substrates include silicon-on-insulator (SOI) and other engineered wafers designed to provide tailored electrical and physical characteristics.
- [Featured Expert: Applied Materials](https://semiconductorindustrymonthly.com/featured-expert-applied-materials/): Applied Materials, Inc. is a global supplier of semiconductor fabrication equipment and related technologies headquartered in Santa Clara, California, USA. The company produces systems used in wafer fabrication processes such as deposition (including physical vapor deposition, chemical vapor deposition, and atomic layer deposition), etch, and planarization.
- [Featured Expert: Amkor Technology, Inc.](https://semiconductorindustrymonthly.com/featured-expert-amkor-technology-inc/): Founded in 1968 and headquartered in Tempe, Arizona, Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S.-headquartered outsourced semiconductor assembly and test (OSAT) provider and a recognized global leader in advanced packaging and test solutions. With decades of engineering innovation and a worldwide manufacturing network, the company supports the design, development, and deployment of next-generation semiconductor technologies.
- [Featured Expert: Socionext Inc.](https://semiconductorindustrymonthly.com/featured-expert-socionext-inc/): Founded in 2015 and headquartered in Yokohama, Japan, Socionext Inc. is a global semiconductor company specializing in the design, development, and supply of advanced System-on-Chip (SoC) solutions. Formed through the integration of the former system LSI businesses of Fujitsu Limited and Panasonic Corporation, Socionext combines decades of engineering innovation and production expertise under one organization. With operations spanning Japan, Asia, the United States, and Europe, the company supports customers worldwide through a combination of design collaboration, silicon implementation, and complete system-level solutions.
- [Socionext Unveils Configurable Chiplet Architecture](https://semiconductorindustrymonthly.com/socionext-unveils-configurable-chiplet-architecture/): Socionext Inc., global industry experts in System-on-Chip (SoC) design and advanced semiconductor solutions, has introduced a new class of configurable chiplets engineered to support the demands of next-generation multi-die systems and heterogeneous integration.
- [Amkor Technology Breaks Ground on $7 Billion Arizona Campus](https://semiconductorindustrymonthly.com/amkor-technology-breaks-ground-on-7-billion-arizona-campus/): Amkor Technology, Inc. has broken ground on its new state-of-the-art outsourced advanced packaging and test campus in Arizona.  The company announced that its total investment for the project has expanded to $7 billion across two phases. This includes additional cleanroom space and a second greenfield packaging and test facility, marking a more than $5 billion increase from initial plans. Upon completion, the campus will feature over 750,000 square feet of cleanroom space, creating up to 3,000 high-quality jobs.
- [Empower Semiconductor Raises $140M for AI Power Delivery](https://semiconductorindustrymonthly.com/empower-semiconductor-raises-140m-for-ai-power-delivery/): Empower Semiconductor announced it has closed more than $140 million in Series D financing. The round was led by Fidelity Management & Research Company with participation from Maverick Silicon, CapitalG, Atreides Management, Socratic Partners, Walden Catalyst Ventures, Knollwood, and a wholly owned subsidiary of the Abu Dhabi Investment Authority (ADIA). Barclays Capital served as exclusive placement agent for the transaction.
- [Featured Expert: La Luce Cristallina](https://semiconductorindustrymonthly.com/featured-expert-la-luce-cristallina/): Founded and headquartered in Austin, Texas, La Luce Cristallina is a U.S.-based innovator in silicon photonics materials and barium titanate (BaTiO₃) electro-optic platforms. The company develops scalable, high-performance substrates that form the basis for next-generation photonic and optoelectronic devices used in data centers, telecommunications, sensing, aerospace, and quantum computing. Its advanced wafer-scale manufacturing processes and secure U.S.-based supply chain are helping to establish a sustainable foundation for the domestic production of high-value photonic materials.
- [La Luce Cristallina Unveils 200MM BaTiO₃ Wafer](https://semiconductorindustrymonthly.com/la-luce-cristallina-unveils-200-mm-batio%e2%82%83-wafer/): La Luce Cristallina, a U.S.-based innovator in silicon photonics materials and barium titanate (BaTiO₃) electro-optic platforms, has launched a new 200 mm (8-inch) barium titanate (BaTiO₃) wafer and opened a state-of-the-art fabrication facility in Austin, Texas. The facility expands capacity for wafer-scale crystal-on-glass BaTiO₃ substrates to support growing demand from data centers, telecommunications, sensing, computing, and integrated photonics markets. With equipment supplied by DCA Instruments of Finland, the facility strengthens collaboration with global partners through a secure, U.S.-based supply chain. The company is now accepting orders for the new wafer, with delivery slated for early Q1 2026.
- [Featured Expert: Multibeam Corp.](https://semiconductorindustrymonthly.com/featured-expert-multibeam-corp/): Multibeam Corp., global industry experts in multicolumn e-beam lithography (MEBL), is pioneering production-grade, maskless patterning systems designed to accelerate semiconductor innovation. Headquartered in Silicon Valley, the company has developed the industry’s first high-throughput MEBL platform specifically engineered for volume manufacturing of advanced node and advanced packaging applications.
- [Multibeam Raises $31M to Expand E-Beam Lithography Platform](https://semiconductorindustrymonthly.com/multibeam-raises-31m-to-expand-e-beam-lithography-platform/): Multibeam Corp. has secured $31 million in Series B funding to accelerate the global deployment of its multi-column E-Beam Lithography (EBL) platform, aimed at next-generation semiconductor manufacturing.
- [onsemi, Schaeffler Partner on New EliteSiC PHEV Platform](https://semiconductorindustrymonthly.com/onsemi-schaeffler-partner-on-new-elitesic-phev-platform/): onsemi, global industry experts in silicon carbide power semiconductors, have announced the expansion of their ongoing collaboration with motion technology company Schaeffler to supply next-generation silicon carbide MOSFETs for a new plug-in hybrid electric vehicle (PHEV) platform.
- [Northwestern, BU, UC Berkeley Build World’s First Electronic-Photonic Quantum Chip](https://semiconductorindustrymonthly.com/northwestern-bu-uc-berkeley-build-worlds-first-electronic-photonic-quantum-chip/): In a major R&D breakthrough, researchers from Northwestern University, Boston University (BU), and the University of California, Berkeley (UC Berkeley) have announced their successful development of the world's first known silicon chip to integrate a photonic quantum system directly into traditional electronic architecture— all fabricated entirely within a commercial semiconductor foundry.
- [Featured Expert:  Elevate Semiconductor](https://semiconductorindustrymonthly.com/elevate-semiconductor/): Founded in 2012 and headquartered in San Diego, California, Elevate Semiconductor is a fabless semiconductor company focused on precision analog and mixed-signal ICs for automated test equipment (ATE), instrumentation, and industrial systems.
- [Featured Expert:  Rapidus](https://semiconductorindustrymonthly.com/rapidus/): Founded in 2022 and headquartered in Tokyo, Japan, Rapidus Corporation is a semiconductor manufacturing company established to accelerate Japan’s domestic capability in advanced chip production. Formed with support from Japan’s Ministry of Economy, Trade and Industry (METI), Rapidus is focused on producing state-of-the-art logic semiconductors at the 2-nanometer node and beyond.
- [Featured Expert:  FuriosaAI](https://semiconductorindustrymonthly.com/furiosaai/): Founded in 2017 and based in Seoul, South Korea, FuriosaAI is a fabless semiconductor company focused on the development of high-performance AI inference chips for edge and data center applications. As a key part of South Korea’s national AI strategy, the company is working to advance energy-efficient and scalable hardware solutions for machine learning workloads.
- [Featured Expert:  KD](https://semiconductorindustrymonthly.com/kd/): Fabless semiconductor supplier KD provides innovative high-speed optical networking solutions. for harsh environments. Founded in 2010 in Madrid, Spain, KD offers its cost-effective technology as a fully qualified automotive-grade ASSP, integrating electronics, photonics, and optics in a single IC. KD’s technology makes use of information theory, innovative digital adaptive algorithms, and analog mixed-signal design to maximize the receiver’s sensitivity.
- [Featured Expert:  Navitas Semiconductor](https://semiconductorindustrymonthly.com/about-navitas-semiconductor/): Navitas Semiconductor (Nasdaq: NVTS) is a U.S.-based power semiconductor company specializing in gallium nitride (GaN) and silicon carbide (SiC) technologies for high-efficiency energy conversion. Its product portfolio includes GaNFast™ power ICs and GeneSiC™ devices for applications across electric vehicles, fast chargers, data centers, renewable energy, and power tools.
- [Featured Expert:  SandboxAQ](https://semiconductorindustrymonthly.com/about-sandboxaq/): SandboxAQ is a B2B technology company advancing capabilities at the intersection of quantum computing and artificial intelligence. The company develops enterprise solutions that apply quantum-inspired algorithms, advanced encryption, and AI-based simulation to address complex challenges across sectors such as life sciences, financial services, and secure navigation. A key innovation is its Large Quantitative Models (LQMs), which enable advanced computational analysis in highly regulated and data-intensive environments.
- [Featured Expert:  Maxwell Labs](https://semiconductorindustrymonthly.com/about-maxwell-labs/): Maxwell Labs is a Minnesota-based technology startup developing novel photonic cooling solutions to improve thermal management in high-performance computing and AI hardware environments. The company’s platform targets the escalating energy demands and heat generation challenges of next-generation semiconductors, including chips used in AI training, inference, and large-scale data centers.
- [Featured Expert:  Pragmatic Semiconductor](https://semiconductorindustrymonthly.com/about-pragmatic-semiconductor/): Pragmatic Semiconductor is an innovator in the design and manufacture of flexible integrated circuits (FlexICs) using thin-film transistor (TFT) technology. Unlike traditional silicon-based chips, FlexICs are ultra-thin, bendable, and can be integrated into non-rigid substrates to support new classes of electronics that are cost-effective, low-power, and scalable. Pragmatic’s circuits are particularly suited for item-level intelligence, such as smart packaging, secure tracking, wearable electronics, and IoT devices at the network edge.
- [Featured Expert:  Blumind](https://semiconductorindustrymonthly.com/about-blumind/): Blumind is a deep-tech startup headquartered in Ottawa, Canada, developing an ultra-low-power analog AI platform purpose-built for real-time edge inferencing. The company’s analog compute-in-memory engine integrates machine learning capabilities directly into silicon, enabling inference to be performed locally on sensors and embedded devices with minimal power consumption and latency. This approach significantly reduces data movement, enabling more efficient decision-making in time-sensitive applications.
- [SEMI and Purdue Launch AI, Data Analytics Online Courses](https://semiconductorindustrymonthly.com/semi-and-purdue-launch-ai-data-analytics-online-courses/): SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain, has announced its partnership with Purdue University to launch a collaborative 10-course online seriesfocused on artificial intelligence (AI) and data analytics for the semiconductor
- [sureCore Expands AI-Focused Memory Design Services](https://semiconductorindustrymonthly.com/surecore-expands-ai-focused-memory-design-services/): sureCore, global industry experts in ultra-low power embedded memory solutions, has expanded its sureFIT™ custom memory design service to address the evolving requirements of AI chip developers. This initiative is aimed at further supporting performance and power optimization at the memory subsystem level, where conventional approaches increasingly fall short of meeting demanding AI workload targets.
- [SandboxAQ Scales LQMs Using NVIDIA DGX Cloud for Discovery](https://semiconductorindustrymonthly.com/sandboxaq-scales-lqms-using-nvidia-dgx-cloud-for-discovery/): SandboxAQ has announced a collaboration with NVIDIA to accelerate breakthroughs in biopharmaceuticals, chemicals, advanced materials, financial services, cybersecurity, navigation, and medical imaging. A member of the NVIDIA Inception program, SandboxAQ isleveraging NVIDIA DGX Cloud on Google Cloud to build a state-of-the-art large quantitative model (LQM) platform, fueling AI-driven scientific discovery.
- [PsiQuantum Awarded $10.8M AFRL Contract for Quantum Chip Development](https://semiconductorindustrymonthly.com/psiquantum-awarded-10-8m-afrl-contract-for-quantum-chip-development/): The Air Force Research Laboratory (AFRL) in Rome, New York, has awarded PsiQuantum a $10.8 million contract to deliver advanced quantum chip capabilities for U.S. Air Force applications. This latest award builds on a partnership established in 2022
- [Sparrow Quantum Secures €21.5 Million to Advance Photonic Quantum Chip Technology](https://semiconductorindustrymonthly.com/sparrow-quantum-secures-e21-5-million-to-advance-photonic-quantum-chip-technology/): Sparrow Quantum has raised €21.5 million in Series A funding to support the development and commercialization of its photonic quantum chip technology. The round was led by PensionDanmark with participation from EIFO, Novo Holdings, and returning investors 2xN, LIFTT, and the European Innovation Council.
- [Navitas, GigaDevice Launch Joint Lab for Power IC-MCU Integration](https://semiconductorindustrymonthly.com/navitas-gigadevice-launch-joint-lab-for-power-ic-mcu-integration/): Navitas Semiconductor has entered a strategic partnership with GigaDevice to establish a joint R&D lab focused on integrating Navitas' GaNFast™ power ICs with GigaDevice's high-performance microcontrollers (MCUs). This collaboration targetsnext-generation, energy-efficient applications in AI data centers, electric vehicles (EVs), solar, and industrial power systems.
- [Ayar Labs Introduces UCIe™ Optical Interconnect Chiplet for AI Systems](https://semiconductorindustrymonthly.com/ayar-labs-introduces-ucie-optical-interconnect-chiplet-for-high-bandwidth-ai-systems/): Ayar Labs has announced the introduction of the industry's first Universal Chiplet Interconnect Express™ (UCIe™) optical interconnect chiplet, designed to maximize performance and efficiency in AI infrastructures by significantly reducing latency and power consumption. Incorporating a UCIe electrical interface, Ayar Labs’ TeraPHY™ optical I/O chiplet offers 8 Tbps bandwidth, powered by the company's 16-wavelength SuperNova™ light source.
- [Blumind Raises $20M CAD Series A to Scale Ultra-Low-Power Analog AI](https://semiconductorindustrymonthly.com/blumind-raises-20m-cad-series-a-to-scale-ultra-low-power-analog-ai/): Blumind, a developer of ultra-low-power analog AI chips for edge computing, has secured $20M CAD in Series A funding to advance the development and commercialization of its AMPL™ technology platform.
- [lowRISC, SCI Release Sunburst Repo for Secure MCU Design](https://semiconductorindustrymonthly.com/lowrisc-sci-release-sunburst-repo-for-secure-mcu-design/): lowRISC C.I.C., the open silicon ecosystem organisation, together with SCI Semiconductor, a leader in CHERI solutions, today announced the release of the open-source Sunburst Chip design repository. The release marks a key milestone in phase two of the DSbD/UKRI-funded Sunburst Project (Grant Number: 107540), and supports the commercialisation of CHERIoT-Ibex based secure microcontrollers, including SCI’s upcoming ICENI device family.
- [U.S. Establishes Investment Accelerator to Oversee CHIPS Office](https://semiconductorindustrymonthly.com/u-s-establishes-investment-accelerator-to-oversee-chips-office/): On March 31, 2025, the White House announced that U.S. President Donald J. Trump had signed an Executive Order establishing the United States Investment Accelerator, a new office within the U.S. Departmentof Commerce. The office will be responsible for facilitating and accelerating large-scale investments of more than $1 billion across the United States, including administration of the CHIPS Program Office.
- [Sandia and Maxwell Labs Explore Photonic Laser Cooling for Data Center Chips](https://semiconductorindustrymonthly.com/sandia-and-maxwell-labs-explore-photonic-laser-cooling-for-data-center-chips/): Maxwell Labs, a Minnesota-based startup, has entered a collaborative research agreement with Sandia National Laboratories and the University of New Mexico to test laser-based photonic cooling for computer chips. The project aims to regulate chip temperatures using light rather than conventional air or water-based systems, potentially reducing energy usage and improving overall efficiency.
- [NLM Photonics Launches Silicon-Organic Hybrid PIC Modulator](https://semiconductorindustrymonthly.com/nlm-photonics-launches-silicon-organic-hybrid-pic-modulator/): NLM Photonics, experts in hybrid organic electro-optic (OEO) technology, has announced the introduction of its groundbreaking 1.6 Terabit DR8 photonic integrated circuit (PIC).This marks a significant commercialization milestone, utilizing the company’s proprietary silicon-organic hybrid (SOH) modulator technology, Selerion™-HTX, for data center applications.
- [Pragmatic Semiconductor Launches Sustainable Flexible NFC Chip Line](https://semiconductorindustrymonthly.com/pragmatic-semiconductor-launches-sustainable-flexible-nfc-chip-line/): Pragmatic Semiconductor Ltd., experts in flexible semiconductor technology, have announced the launch of Pragmatic NFC Connect, a new line of RFID near-field communication (NFC) products designed to expand item-level intelligence across mass-market goods. Built on the company’s FlexIC (flexible integrated circuit) technology, the line delivers NFC endpoint capabilities in an ultra-thin, flexible, and low-carbon form factor, making it possible to integrate NFC into previously inaccessible applications.
- [Keysight Debuts Dynamic Test Method for WBG Semiconductor Bare Chips](https://semiconductorindustrymonthly.com/keysight-debuts-dynamic-test-method-for-wbg-semiconductor-bare-chips/): Keysight Technologies has introduced a new dynamic testing solution that simplifies the evaluation of wide-bandgap (WBG) semiconductor bare chips.The innovative fixture enables device engineers to perform accurate, repeatable double-pulse testing of bare dies without the need for wire bonding, probe needles, or soldering—all while minimizing parasitic inductance.
- [Nanomotion Introduces Precision Motion Systems for Semiconductors](https://semiconductorindustrymonthly.com/nanomotion-introduces-precision-motion-systems-for-semiconductors/): Nanomotion has developed a new line of precision motion systems for semiconductor production and metrology applications. Designed to meet the demands of next-generation tools, the systems support ultra-high resolution positioning, sub-nanometer stability below 0.25 nm, and resistance to environmental factors such as vibration and temperature variation.
- [Wave Photonics Unveils SiNQ Process for Quantum Photonics](https://semiconductorindustrymonthly.com/wave-photonics-unveils-sinq-process-for-quantum-photonics/): Wave Photonics, experts in integrated photonics design, has announced the availability of SiNQ, a silicon nitride fabrication process developed by CORNERSTONE for quantum photonic systems and emitters.
- [EXTOLL Partners with BeammWave, GF on High-Speed ASICs](https://semiconductorindustrymonthly.com/extoll-partners-with-beammwave-gf-on-high-speed-asics/): EXTOLL, a provider of high-speed, ultra-low-power SerDes and chiplet connectivity, has been selected by BeammWave as a key SerDes IP supplier for its next-generation mmWave 5G/6G communication ASICs.
- [Baya Systems Secures $36M to Advance AI and Chiplet Design](https://semiconductorindustrymonthly.com/baya-systems-secures-36m-to-advance-ai-and-chiplet-design/): Baya Systems, experts in system IP technology for intelligent compute acceleration, has raised $36+ million in Series B funding to advance the development and deployment of its software-driven system IP technology for SoC designs and chiplet-based architectures.
- [TransPak Opens 300,000-Square-Foot Facility in Texas](https://semiconductorindustrymonthly.com/transpak-opens-300000-square-foot-facility-in-texas/): TransPak has opened a 300,000-square-foot campus in Manor, Texas, expanding its support for semiconductor and advanced manufacturing customers in the greater Austin area.
- [SemiQ Launches 1700 V SiC MOSFETs for PV, EV and Energy Storage](https://semiconductorindustrymonthly.com/semiq-launches-1700-v-sic-mosfets-for-pv-ev-and-energy-storage/): SemiQ Inc., a designer, developer, and global supplier of high-performance silicon carbide (SiC) power semiconductors, has introduced a new family of 1700 V SiC MOSFETs optimized for medium-voltage, high-power conversion applications,including photovoltaic (PV) and wind inverters, energy storage systems (ESS), EV and roadside charging, uninterruptible power supplies (UPS), and induction heating/welding systems.
- [StratEdge Names Vitale Engineering as Upstate New York Reps](https://semiconductorindustrymonthly.com/stratedge-names-vitale-engineering-as-upstate-new-york-reps/): StratEdge Corporation has appointed Vitale Engineering as its exclusive manufacturer’s representative for Upstate New York. Vitale Engineering will support the regional promotion of StratEdge’s semiconductor packaging technologies, including post-fired and molded ceramic packages designed for high-frequency and high-power applications in aerospace, telecommunications, defense, and related sectors.
- [University of Vermont GaN Tech Hub Awarded $23.7M for Semiconductor R&D](https://semiconductorindustrymonthly.com/university-of-vermont-gan-tech-hub-awarded-23-7m-for-semiconductor-rd/): The Vermont Gallium Nitride (V-GaN) Tech Hub, a consortium led by the University of Vermont (UVM) with GlobalFoundries and the State of Vermont, has been awarded $23.7 million in funding from the U.S. Economic Development Administration.
- [Quantum Brilliance Raises $20M to Scale Diamond Quantum Tech](https://semiconductorindustrymonthly.com/quantum-brilliance-raises-20m-to-scale-diamond-quantum-tech/): Quantum Brilliance (QB), a developer of room-temperature diamond quantum devices, has raised $20 million in a Series A funding round. The investment will support the creation of a quantum diamond foundry, co-development of quantum sensing prototypes, advancement of proprietary IP with semiconductor partners, and fulfillment of current technology delivery commitments.
- [imec Spin-Off Vertical Compute Raises €20M for AI Chip Development](https://semiconductorindustrymonthly.com/vertical-compute/): Vertical Compute, a new spin-off from imec, has raised €20 million in seed funding to develop vertically integrated memory and compute technology for AI applications. The investment round was led by imec.xpand and joined by Eurazeo, XAnge, Vector Gestion, and imec. The company is headquartered in Louvain-La-Neuve with R&D centers in Leuven, Grenoble, and Nice.
- [ASU Research Park Selected for Advanced U.S. Semiconductor R&D Facility](https://semiconductorindustrymonthly.com/arizona-state-university-research-park/): Researchers work inside the cleanroom area at the MacroTechnology Works facility in the ASU Research Park in Tempe, Arizona. The facility supports advanced semiconductor R&D, prototyping, and workforce development initiatives. (Photo by Deanna Dent/Arizona State University.)
- [TI Secures $1.6B in CHIPS Act Funding for Texas, Utah Expansions](https://semiconductorindustrymonthly.com/ti-secures-1-6b-in-chips-act-funding-for-texas-utah-expansions/): Texas Instruments (TI) has announced that it is the recipient of up to $1.6 billion in funding from the U.S. Department of Commerce under the CHIPS Act. The funding will support three new 300mm semiconductor wafer fabs currently under construction in Sherman, Texas, and Lehi, Utah. The announcement follows the preliminary memorandum of terms announced in August 2024 and will include disbursement of funds tied to the achievement of key project milestones through 2029.
- [X-FAB Unveils Next-Gen SiC Platform for Power MOSFET Designs](https://semiconductorindustrymonthly.com/x-fab-unveils-next-gen-sic-platform-for-power-mosfet-designs/): X-FAB Silicon Foundries SE, a leader in analog/mixed-signal and specialty semiconductor manufacturing, has introduced XSICM03, the company's next-generation XbloX platform for Silicon Carbide (SiC) power MOSFETs. This advanced platform delivers a significant reduction in cell pitch, increasing die per wafer while improving on-state resistance and maintaining robust reliability.
- [Power Integrations Debuts 1700V IC for 800V EV Applications](https://semiconductorindustrymonthly.com/power-integrations-debuts-1700v-ic-for-800v-ev-applications/): Power Integrations, a provider of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has introduced a wide-creepage package option for its InnoSwitch™3-AQ flyback automotive switcher IC, designed to meet the stringent requirements of next-generation EVs.
- [Diodes Incorporated Expands Automotive LED Driver Portfolio](https://semiconductorindustrymonthly.com/diodes-incorporated-expands-automotive-led-driver-portfolio/): Diodes Incorporated, a global provider of high-quality semiconductor products, has introduced the AL8866Q, an automotive-compliant DC-switching LED driver-controller. This advanced device drives external MOSFETs and supports multiple topologies, including buck, boost, buck-boost, and single-ended primary-inductance converter (SEPIC) configurations for high-power LED lighting systems.
- [GlobalFoundries Joins LOT Network to Strengthen Patent Protection](https://semiconductorindustrymonthly.com/globalfoundries-joins-lot-network-to-strengthen-patent-protection/): GlobalFoundries joins LOT Network, adding its nearly 10,000 patent assets to the world’s largest patent protection community. (Photo courtesy of GlobalFoundries.)
- [Bosch Awarded $225M in CHIPS Act Funding for SiC Chip Production](https://semiconductorindustrymonthly.com/bosch-awarded-225m-in-chips-act-funding-for-sic-chip-production/): Bosch, a global leader in semiconductor and automotive technologies, has signed a preliminary memorandum of terms (PMT) with the U.S. Department of Commerce, securing up to $225 million in proposed direct funding under the CHIPS and Science Act. This funding will support Bosch’s
- [Ayar Labs Secures $155M to Scale Optical Interconnects for AI](https://semiconductorindustrymonthly.com/ayar-labs-secures-155m-to-scale-optical-interconnects-for-ai/): Ayar Labs, global experts in optical interconnect solutions for large-scale AI workloads, has announced that it has successfully raised $155 million in Series D funding address the bottlenecks in data movement for AI infrastructure with its optical I/O technology.
- [CEA-Leti Unveils First Device to Both Sense and Modulate Light](https://semiconductorindustrymonthly.com/cea-leti-unveils-first-device-to-both-sense-and-modulate-light/): CEA-Leti researchers have developed the first device capable of both sensing and modulating light within a single unit. This innovation integrates a liquid crystal cell with a CMOS image sensor, enabling a compact and scalable system with intrinsic optical alignment. The breakthrough is expected to drive the adoption of digital optical phase conjugation (DOPC) techniques in applications such as microscopy and medical imaging.
- [TOPPAN Joins US-JOINT for Next-Gen Semiconductor Packaging Advancements](https://semiconductorindustrymonthly.com/toppan-joins-us-joint-for-next-gen-semiconductor-packaging-advancements/): TOPPAN Inc., a wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has announced its participation in US-JOINT, a US-Japan consortium dedicated to advancing next-generation semiconductor packaging.Established in July 2024 and led by Resonac Corporation, the consortium aims to drive innovation in semiconductor packaging technologies. TOPPAN’s role as a participating packaging substrate manufacturer highlights its expertise in semiconductor manufacturing and its commitment to advancing the industry.
- [IBM Pioneers Co-Packaged Optics with PWG for AI Data Centers](https://semiconductorindustrymonthly.com/ibm-pioneers-co-packaged-optics-with-pwg-for-ai-data-centers/): IBM has unveiled a breakthrough in co-packaged optics (CPO) technology, leveraging polymer optical waveguides (PWG) to significantly enhance AI data center performance. This advancement represents the first successful implementation of PWG to support CPO, as detailed in IBM Research’s recently published technical paper. The innovation enables high-bandwidth optical connectivity, offering faster AI model training, improved energy efficiency, and reduced data transmission delays.
- [DigiKey Signs Global Distribution Agreement with MediaTek](https://semiconductorindustrymonthly.com/digikey-signs-global-distribution-agreement-with-mediatek/): DigiKey, a global distributor of electronic components and automation products, has announced that it has signed a global sales and distribution agreement with MediaTek, the world’s fifth-largest fabless semiconductor company.

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