Socionext Unveils Configurable Chiplet Architecture

Socionext Inc., global industry experts in System-on-Chip (SoC) design and advanced semiconductor solutions, has introduced a new class of configurable chiplets engineered to support the demands of next-generation multi-die systems and heterogeneous integration.

As monolithic SoC designs approach physical and economic limits — such as reticle size constraints, yield challenges, and thermal bottlenecks —the semiconductor industry is shifting toward chiplet-based architectures. This modular approach allows key functional blocks to be integrated within a single package, improving scalability, performance, and production efficiency.

Socionext’s configurable chiplet platform provides RTL-level composability, enabling customers to co-design at the register-transfer level and integrate custom logic alongside third-party IP. This flexibility supports diverse applications across high-performance computing, advanced networking, and next-generation automotive systems while reducing development time and accelerating time-to-market.

Unlike fixed-function ASSP chiplet designs that limit customization, Socionext’s architecture offers a configurable RTL chiplet library, allowing customers to tailor power and performance parameters to meet specific application requirements. Its open, interoperable structure supports integration of best-in-class IP from multiple vendors, enabling differentiated product development across a shared ecosystem.

Each chiplet design incorporates embedded security, debug features, and optimized interfaces. Engineering samples of initial base designs, including Known Good Die (KGD), are currently in development. The company expects its first customer design engagement to begin this year, with expanded collaboration planned for Q2 2026.

The initial series of chiplets includes scalable memory configurations supporting DDR and LPDDR standards via UCIe-S or UALink; high-speed networking connectivity through 224G/UE bridged to UCIe 2.0; PCIe Gen7 128G PHY to UCIe 2.0 bridging with configurable lane options; and hybrid PCIe plus Ethernet controller units designed for flexible I/O bridging of 224G/UE SerDes to UCIe 2.0.

All designs are compatible with 2.5D and 3D advanced packaging technologies, including CoWoS, SoW-X, EMIB, and 3D stacking, and support leading-edge process nodes at 2nm, 3nm, and 5nm. Standard high-speed interfaces such as UCIe, UALink, PCIe Gen7, and Ultra Ethernet ensure interoperability across multi-vendor environments. Socionext is also developing a web-based configuration tool that allows engineers to visualize and validate chiplet designs using a drag-and-drop interface connected to a curated IP library. Flexible engagement models will enable design support tailored to customer development cycles and commercialization strategies.

With demonstrated success in 2nm and 3DIC test vehicle tapeouts, Socionext has shown its capability to integrate up to 128 instances of 224G SerDes within a single package. This foundation combines high integration density with robust power efficiency, enabling customers to scale performance across complex, multi-die systems. By combining RTL-level configurability, open IP integration, and advanced packaging support, Socionext’s new chiplet ecosystem establishes a modular and scalable foundation for next-generation semiconductor innovation.  For more information, please click here. 

About Socionext Inc.
Socionext Inc. is a global semiconductor company headquartered in Yokohama, Japan, specializing in the design, development, and supply of advanced System-on-Chip (SoC) solutions. Established in 2015, the company integrates extensive experience in digital, analog, and mixed-signal technologies to support a wide range of applications in automotive electronics, data centers, networking infrastructure, smart devices, and industrial systems. Socionext maintains offices across Japan, Asia, the United States, and Europe to provide localized development and customer support. To learn more, please click here.

Source/Photo Credit: Socionext Inc.

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