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Semiconductor Industry Monthly image for article on Siemens and Samsung Foundry collaboration on advanced-node EDA, photonic IC verification, test, and 3D IC packaging

Siemens, Samsung Foundry Advance EDA Collaboration

May 2026 Molly Bakewell Chamberlin

Siemens and Samsung Foundry are continuing their collaboration on advanced semiconductor design and manufacturing workflows, with a focus on electronic design automation, photonic integrated circuit verification, design-for-test, advanced packaging, analog and RF verification, and digital implementation. The companies highlighted the collaboration at Samsung SAFE Forum 2026, where Samsung Foundry and ecosystem partners presented design enablement […]

Photo of Semiconductor Wafer for Article Entitled Siemens Qualified IC Design Solutions for Intel

Siemens Certifies IC Design for Intel Foundry Processes

February 2024June 25, 2025 Molly Bakewell Chamberlin

Siemens Certifies Industry-Leading IC Design Solutions for Intel Foundry Processes Siemens Digital Industries Software has announced the certification of its Calibre® nmPlatform tool and Analog FastSPICE (AFS) platform for Intel 18A and Intel 16 process technologies. Intel 18A, equipped with RibbonFET Gate-All-Around (GAA) transistor architecture and PowerVia backside power delivery technologies, significantly advances Intel Foundry’s […]