TOPPAN Inc., a wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has announced its participation in US-JOINT, a US-Japan consortium dedicated to advancing next-generation semiconductor packaging.Established in July 2024 and led by Resonac Corporation, the consortium aims to drive innovation in semiconductor packaging technologies. TOPPAN’s role as a participating packaging substrate manufacturer highlights its expertise in semiconductor manufacturing and its commitment to advancing the industry.
Addressing the Challenges of Advanced Semiconductor Packaging
The rapid adoption of generative AI, autonomous driving, and other advanced technologies has increased demand for next-generation semiconductors with complex packaging structures such as 2.5D and 3D designs. These sophisticated architectures, which involve mounting multiple chips on interposers or stacking them vertically, require innovative materials and precise manufacturing processes.
To address these demands, US-JOINT serves as a collaborative platform that unites ten leading material and equipment manufacturers from the US and Japan. Headquartered in Silicon Valley, the consortium focuses on accelerating the development of cutting-edge semiconductor packaging solutions through close cooperation with customers.
Through its participation, TOPPAN will leverage its technical capabilities in high-end packaging substrates to address challenges in advanced semiconductor packaging while identifying new business opportunities and expanding its product portfolio.
Future Activities
US-JOINT’s operations will be based in a state-of-the-art facility in Silicon Valley. Clean room construction and equipment installation are underway, with full operational capability expected by 2025. The facility will feature prototype lines dedicated to research and development in back-end processing, including chip mounting, interposers, and advanced packaging substrates.
TOPPAN will contribute FC-BGA substrates and next-generation semiconductor packaging materials to support these initiatives. The company’s involvement is focused on capturing evolving market needs and advancing the development of materials and processes critical to semiconductor packaging.
Driving Innovation Through Collaboration
TOPPAN’s participation in US-JOINT underscores its commitment to solving the challenges of advanced semiconductor packaging through collaboration and innovation. By aligning with industry leaders, the company aims to strengthen its presence in the global semiconductor market and contribute to the evolution of packaging technologies essential for future applications.
About the TOPPAN Group
Established in Tokyo in 1900, the TOPPAN Group is a global provider of sustainable, integrated solutions across printing, communications, security, packaging, décor materials, electronics, and digital transformation. With over 50,000 employees worldwide, TOPPAN delivers industry-leading expertise and technologies to address business and societal challenges while contributing to shared sustainability goals.
Source/Photo Credit: TOPPAN Group
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